Monday, December 9, 2024
Tag:

packaging

IBM and SUSS MicroTec Sign Agreement to Develop IBM’s Semiconductor Packaging Technology

IBM and SUSS MicroTec today announced they have signed an agreement to develop and commercialize IBM's next-generation, 100 percent lead-free semiconductor packaging technology, C4NP.

Quit Discounting and Start Packaging to Make More Money

We all know consumers are motivated by good offers and great deals. They want to feel like they are receiving a great value. Business owners are often inclined to discount their goods or services to appeal to their customers and prospects. Discounting by offering a dollar amount or a percentage off is certainly an easy and enticing way to stimulate sales and/or increase trial. But, there may better ways to accomplish the same tasks.