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packaging
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IBM and SUSS MicroTec Sign Agreement to Develop IBM’s Semiconductor Packaging Technology
IBM and SUSS MicroTec today announced they have signed an agreement to develop and commercialize IBM's next-generation, 100 percent lead-free semiconductor packaging technology, C4NP.
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Quit Discounting and Start Packaging to Make More Money
We all know consumers are motivated by good offers and great deals. They want to feel like they are receiving a great value. Business owners are often inclined to discount their goods or services to appeal to their customers and prospects. Discounting by offering a dollar amount or a percentage off is certainly an easy and enticing way to stimulate sales and/or increase trial. But, there may better ways to accomplish the same tasks.